Abstract:

Thermoelectric coolers (TECs) are pivotal in modern heat management but face limitations in efficiency and manufacturing scalability. We address these challenges by employing an extrusion-based 3D printing technique to fabricate high-performance thermoelectric materials. Our ink formulations ensure the integrity of the 3D-printed structure and effective particle bonding during sintering, achieving record-high zT values of 1.46 for p-type (Bi,Sb)2Te3 and 1.35 for n-type Ag2Se materials at room temperature. The resulting TEC demonstrates a cooling temperature gradient of 50 °C and a coefficient of performance of 3.8. Moreover, this scalable and cost-effective method circumvents energy-intensive and time-consuming steps, such as ingot preparation and subsequently machining processes, offering a transformative solution for thermoelectric device production, heralding a new era of efficient and sustainable thermoelectric technologies.