Seminar

The Central Fabrication Laboratory (CFL) is a cutting-edge cleanroom facility located at the University of Hong Kong. Its primary mission is to provide advanced fabrication facilities and expertise to enhance teaching and research activities in micro/nano fabrication. As a leading research laboratory, CFL offers open access not only to University of Hong Kong members but also to local and international institutions, researchers, and companies, with collaborations from the private sector always encouraged. The technical sharing sessions offered by CFL are designed to keep participants updated on the latest micro/nano fabrication techniques and provide valuable networking opportunities with experts from around the world. Ultrasonic scanning microscopy is an increasingly utilized detection device and method in the semiconductor industry, especially with the explosive growth in demand for AI chips and memory chips. The application of advanced packaging processes such as 2.5D, 3D, HBM, TSV, and TGV has made the detection of internal defects in semiconductor devices crucial for ensuring the reliability and stability of chips. Currently, ultrasonic testing is the only method available to address this issue. This presentation will primarily focus on the basic principles of ultrasound, the differences between ultrasonic testing vs. other detection methods, the fundamental techniques of ultrasonic testing, and the application of ultrasonic testing in the semiconductor industry and advanced packaging.